Japanese semiconductor materials manufacturer Resonac announced the establishment of the alliance "JOINT3", a 27 global enterprise-wide enterprise, with the goal of developing advanced chip packaging technology.
The alliance companies come from material manufacturers, equipment suppliers and chip design companies in the United States, Japan, and Singapore, such as application materials and Tokyo Vili Technology.
(Source: Businesswire, the same below)
Resonac said in the statement that the alliance will jointly develop materials, equipment and design tools to produce interposers made of organic material square substrates and use 515 x 510 mm as an evaluation test line.
Hidenori Abe, technical director of the semiconductor materials business in Resonac, said JOINT3 is an "instant practice for material manufacturers, equipment suppliers and design companies to develop materials, equipment and technology for intermediaries for large-size substrate manufacturing. The results expected by this alliance will be highly demanded by most relevant companies in the industry.
Unlike traditional manufacturing methods, in the past, square intermediary layers were cut from round, non-organic silicon wafers. JOINT3 hopes to increase the number of intermediary layers that can be produced in a single plane through the organic square substrate, thereby reducing costs.
Resonac will set up an "Advanced Panel-Level Intermediary Center" (APLIC) in Ibaraki Prefecture, Japan, and will test the enclosure prototype, which is expected to be launched in 2026. Alliance members will accelerate the research and development process by providing verification results that are close to the actual application scenario.
Resonac said the five-year plan, with a total investment of 26 billion yen (about 1.74 billion US dollars), will be jointly invested and operated by participating companies. Hidehito Takahashi, the company's president, pointed out that with the rapid expansion of generative AI and self-taught technology, the demand for semiconductor technology is becoming increasingly sophisticated and complex. I believe that now is the time to work together across enterprises and the world.
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